(ICRMV 2025) 2025 9th International Conference on Robotics and Machine Vision
Automation SciencesRobotComputer Science and Technologies
Conference Date
Jan 10-Jan 12, 2025
Submission Deadline
Dec 01, 2024
E-mail
icrmv_conf@163.com
Telephone
+86-19130670943
ICRMV 2025 [ACM-Ei Compendex and Scopus]
★Full name: 2025 9th International Conference on Robotics and Machine Vision
★Abbreviation: ICRMV 2025
★Time:January 10-12,2025
★Place:Shanghai, China
★Website:http://www.icrmv.org/
The 9th International Conference on Robotics and Machine Vision (ICRMV 2025) will be held during January 10-12, 2025 in Shanghai, China. It's sponsored by Shanghai University of Engineering Science (SUES), and hosted by School of Mechanical and Automotive Engineering, SUES, China. The mission of ICRMV is to provide an interactive learning and relationship-building forum for all researchers in the Robotics and Machine Vision field.
★Call for paper★
Topics of interest for submission include, but are not limited to:
Robot control
Robotic Kinematics
Robot sensing and data fusion
Medical robots and bio-robotics
Tracking and surveillance
Activity/behaviour recognition
Localization, navigation and mapping
Mechanism design and applications
For more topics, please visit at http://www.icrmv.org/cfp.html
★Publication★
ICRMV 2025 accepted papers will be collected in ICRMV 2025 Conference Proceedings, which will be published in International Conference Proceedings Series by ACM and archived in ACM Digital Library. The proceedings will be indexed by EI Compendex, Scopus, and submitted to be reviewed by Thomson Reuters Conference Proceedings Citation Index (ISI Web of Science).
★Organizing Committee★
**Conference Chairs:
Chun-Yi Su, Concordia University, Canada;
Yu Fang, Shanghai University of Engineering Science, China;
Jie Chen, China Electronic Technology Robot Co.Ltd, China.
**Conference Co-Chairs:
Dazhong Wang, Shanghai University of Engineering Science (SUES), China;
Chunlei Wang, China Electronic Technology Robot Co.Ltd, China.
**Program Chairs:
Chiharu ISHII, Hosei University, Japan;
Liangjing Yang, Zhejiang Univeristy, China;
Huafeng Ding, China University of Geosciences, China;
Xingjian Jing, City University of Hong Kong, China.
**Program Co-Chairs:
Haifeng Ma, Shandong University, China;
Lau Tat Ming Darwin, The Chinese University of Hong Kong, China;
Genliang Xiong, Shanghai University of Engineering Science (SUES), China.
**Publicity Chairs:
Qingjuan Duan, Xidian University, China;
Zina Zhu, Shanghai University of Engineering Science (SUES), China;
Wenjun Ye, Concordia University, Canada.
**Local Organizing Committee:
Chunlei Jiang, Shanghai University of Engineering Science (SUES), China;
Zhiwei Xu, Shanghai University of Engineering Science (SUES), China;
Zifan Zeng, Shanghai University of Engineering Science (SUES), China.
★Submission★
1. Full paper (Publication and Presentation)
2. Abstract (Only Presentation)
Submission Online Electrical System (.pdf): https://www.zmeeting.org/submission/icrmv2025
Send directly to email:icrmv_conf@163.com.
More detail about submission, please visit at http://www.icrmv.org/submission.html
★Conference Venue★
Shanghai University of Engineering Science (SUES)
www.sues.edu.cn
333 Long Teng Road, Shanghai 201620, China
★Contact★
Ms. Leah Liu (Conference Secretary)
Web: http://www.icrmv.org/
Email: icrmv_conf@163.com
Wechat ID: Iconf-ras
Tel: +86-19130670943 (Working Days Only - from 10:00 to 18:00)