Engineering

The progress of CMOS devices downsizing, either by shortening the gate-length/half-pitch spacing or by folding the channel width, will be ended in a couple of generations. However, Moore's Law will continue to grow for at least another decade by adopting some emerging technologies such as 3D stacking in IC manufacturing or time scaling for device operation. Meanwhile, the significant advancement in the More-than-Moore, in the aspects of applications, system architecture, computing strategy, and networking technology domains, SoC introduction would empower an ordinary digital device to have much high-speed or even supercomputing capability. In the last decade, System-on-Chip (SoC) products, including smart phones, tablets, netbooks, embedded systems, wireless communications, and ASIC products, have emerged as the rising stars in the mobile and embedded IC markets.
The main subject of the special issue is microelectronic devices, circuits, and systems and their application in digital circuits and systems, RFIC and microwave integrated circuits, materials in electronics, nanoelectronics devices and circuits, fault-tolerant electronic design, modeling reliability versus ageing in low power electronics, analysis of radiation impact on reliability of electronic devices, circuits, and systems. This special issue aims to provide state-of-art and papers related to electron devices, elemental semiconductors, CMOS technology, device physics, device simulation, nanoelectronics, device reliability, power devices, optodevices, microwave devices, devices characterization.
Findings and discussion of the special issue should improve the potential of the research and development in the academic and industry environments.

Co-Chairmen:
D. Dankovic, University of Nis, Serbia
V. Davidovic, University of Nis, Serbia

Former Chairman:
N. Stojadinovic, University of Nis, Serbia

Vice-Chairmen:
S. Dimitrijev, Griffith University, Australia
Z. Stamenkovic, University of Potsdam, Potsdam, Germany
S. Selberherr, Technical University of Vienna, Austria
H. Wong, City University of Hong Kong, Hong Kong

Conference Secretary:
M. Z. Randjelovic, University of Nis, Serbia
S. Veljkovic, University of Nis, Serbia
N. Mitrovic, University of Nis, Serbia
M. Marjanovic, University of Nis, Serbia
E. Zivanovic, University of Nis, Serbia

Contact details:
Faculty of Electronic Engineering
University of Nis
Aleksandra Medvedeva 14, 18000 Nis
Serbia
phone: +381 18 529 325, +381 18 529 326
fax: +381 18 588 399
E-mail: miel@elfak.ni.ac.rs

The authors of contributed papers are expected to submit two-page extended abstracts (including figures, tables, and references) that will serve for the paper selection. A cover page of the abstract should include the paper title, authors, and complete address (including fax and e-mail) of the author to be contacted. The abstracts can be submitted in electronic form (either MS Word, PDF, or PostScript files) via E-mail sent to Conference Secretariat (miel@elfak.ni.ac.rs) by April 25th, 2025. Also, the abstracts can be submitted via System for manuscript submission.