Electronics and Electrical Engineering

2025 Organizing Committee
LEADERSHIP TEAM

General Chair
Amy Marconnet
Purdue University
Program Chair
Milnes David
IBM Corporation

Vice Program Chair
Jack Maddox
University of Kentucky
Communication Chair
Pritish Parida
IBM Research
COMPONENT-LEVEL THERMAL MANAGEMENT

Track Chair
Luca Amalfi
SEGUENTE, Inc.
Track Co-Chair
Stephanie Allard
IBM Corporation
Track Co-Chair
Prabhakar Subrahmanyam
Dell
Track Co-Chair
Darin Sharar
Army Research Labs
SYSTEM-LEVEL THERMAL MANAGEMENT

Track Chair
Amir Shooshtari
University of Maryland
Track Co-Chair
Patrick Shamberger
Texas A&M University
Track Co-Chair
Shadi Mahjoob
California State University, Northridge
Track Co-Chair
Lang Yuan
Intel Corporation
MECHANICS AND RELIABILITY

Track Chair
David Huitnik
University of Arkansas
Track Co-Chair
Paul Paret
NREL
Track Co-Chair
Sanjoy Saha
AMD
Track Co-Chair
Tiwei Wei
Purdue University
EMERGING TECHNOLOGIES AND FUNDAMENTALS

Track Chair
Sukwon Choi
Penn State
Track Co-Chair
Jimil Shah
Stealth Startup
Track Co-Chair
Baris Dogruoz
Track Co-Chair
Saket Karajgikar
Meta
SPECIAL TECHNICAL CONTRIBUTIONS

Panel Chair
Victor Chiriac
Global Technology Cooling Group
Panel Co-Chair
Kim Saviers
Raytheon Tech


Panel Co-Chair
Luca Amalfi
Seguente

Panel Co-Chair
Chirag Kharanagate
Case Western Reserve Unversity

Tech Talk Chair
Georges Pavlidis
University of Connecticut
Tech Talk Co-Chair
Qian Han
Sorrento Solution

Tech Talk Co-Chair
Rinaldo Miorini
GE

Tech Talk Co-Chair
Mehdi Asheghi
Stanford University

Keynotes Chair
Justin Weibel
Purdue University
Keynotes Co-Chair
Vadim Getkin
QualComm

Student Poster Chair
Aakrati Jain
IBM
Student Poster Co-Chair
Kalind Baraya
IBM
Student Poster Co-Chair
Karthekeyan Sridhar
Texas Instruments

Research Workshop Chair
Patrick Shamberger
Texas A&M University
Research Workshop Co-Chair
Sreekant Narumanchi
NREL
Research Workshop Co-Chair
Satish Kumar
Georgia Institute of Technology

ITherm/ECTC Diversity Panel Representative
Cristina Amon
University of Toronto
PDC Chair
Jeffrey Suhling
Auburn University
PDC Co-Chair
Kitty Pearsall
IBM (Retired)
ADMINISTRATIVE

Finance Chair
Gargi Kailkhura

Finance Co-Chair
Sameer Rao
University of Utah

Operations Chair
Yuanchen Hu
IBM Corporation
Operations Co-Chair
Pardeep Shahi
Nvidia

Conference Assistant and Webmaster
Damaris David
DDB Conference and Event Services
SPONSORS AND EXHIBITORS

Sponsorship and Exhibitor Co-Chair
Mehdi Asheghi
Stanford University
Sponsorship and Exhibitor Co-Chair
Ashish Gupta
AMD
COMMUNICATION

Conference Proceedings
Paul Wesling
Consultant

Social Media
Chirag Kharangate
Case Western Reserve University
Branding and Graphic Design
Jack Maddox
University of Kentucky
AWARDS

Richard Chu Award Chair
Sushil Bhavnani
Auburn University
Richard Chu Award Co-Chair
Koneru Ramakrishna
Thermal Consultant
Richard Chu Award Co-Chair
Yogendra K. Joshi
Georgia Institute of Technology

Best Paper Award Chair
Yogendra K. Joshi
Georgia Institute of Technology
Best Paper Award Co-Chair
Koneru Ramakrishna
Thermal Consultant
Best Paper Award Co-Chair
Jeffery Suhling
Auburn University

Call for Nominations – 2025 Richard Chu Award
Nomination deadline: March 11, 2025

The ITherm 2025 Awards Committee is seeking nominations for the Richard Chu Award for Excellence in Thermal and Thermo-Mechanical Management of Electronics, formerly known as the ITherm Achievement Award. This award, instituted in 1996, had been presented biennially in recognition of significant contributions made in thermal and thermo-mechanical aspects of electronics devices and systems. Following IEEE Electronics Packaging Society (EPS) Board of Governors approval of an annual ITherm Conference, it is now awarded annually. The Award has been re-named to honor the late Richard Chu, the first recipient of the ITherm Achievement Award, and a seminal contributor to thermal management of electronics.

The Award, to be presented during the 2025 ITherm Conference, includes a memento, a plaque, and a $1500 honorarium. Conference registration, and two nights of lodging will be complimentary. The recipient is expected to present an Invited Lecture on a topic of relevance to the conference themes.

The selection criterion and required nomination materials are detailed below. Nomination packets should be submitted by March 11, 2025 to:

Prof. Sushil H. Bhavnani, Awards Chair, bhavnsh@auburn.edu
Dr. Koneru Ramakrishna, Awards Co-chair, rama@ieee.org
Prof. Yogendra K. Joshi, Awards Co-chair, yogendra.joshi@me.gatech.edu
The sole selection criterion for the award is seminal contributions to the science and art of thermal and/or thermo-mechanical aspects of electronic devices and systems, as demonstrated by archival publications in prestigious journals, patents, or other groundbreaking achievements. Service and societal activities, although relevant, will not be major considerations for selection. IEEE-EPS membership is encouraged but not required. A list of past recipients is available at: https://www.ieee-itherm.net/richard_chu_achievement_award/

The nomination should include:

A two-page letter from the nominator summarizing the nominee’s qualifications,
Up to three letters of support (a minimum of two are required),
A detailed curriculum vitae.