(ISDEA 2023) 2023 2nd International Conference on Intelligent Systems Design and Engineering Applications

Systems Engineeringartificial intelligence

Conference Date

May 12-May 14, 2023

Place

Okayama, Japan

Submission Deadline

Mar 30, 2023

E-mail

isdea_conf@163.com

Telephone

13880104217

Description

Abbreviation: ISDEA 2023
Full Name: 2023 2nd International Conference on Intelligent Systems Design and Engineering Applications (ISDEA 2023)
Okayama, Japan
May 12-14, 2023
http://www.isdea.org/

Publication:
All accepted papers in the regular oral presentation / poster will be published in ISDEA 2023 conference proceedings and included into Lecture Notes in Electrical Engineering-Springer book series after review, which is indexed by EI Compendex and Scopus databases.

Call for Papers:
Web intelligence
Search engines
Risk management
Artificial Neural Networks
Mathematical foundations of neural networks
Architectures and algorithms
Image, video and multidimensional signal processing
Derivatives pricing
Information retrieval (web mining)
Discovering patterns in continuous data
Uncertainty management for data mining
Clustering algorithms and applications
Adaptation and learning
Parallel database systems
Data and knowledge sharing
Automated software Testing and analysis
Knowledge-based software engineering
Cognitive networking
Knowledge based control systems
Adaptive control systems
More topics: http://www.isdea.org/cfp.html

Venue:
Okayama University, Japan
Address: 1丁目-1-1 Tsushimanaka, Kita Ward, Okayama, 700-8530

Submission Methods:
Full Paper (publication and oral presentation)
Abstract (oral presentation only)
Electronic Submission System: http://confsys.iconf.org/submission/isdea2023
Or you could submit your paper by email directly via isdea_conf@163.com

Contact:
Ms. Rachel Cao
Email: isdea_conf@163.com
Tel: +86-13880104217