(ICMPM 2019) 2019 6th International Conference on Mechanical Properties of Materials
Material Sciences & NanotechnologyElectronics and Electrical EngineeringMechanical Engineeringmanufacturing
Conference Date
Jul 23-Jul 25, 2019
Submission Deadline
May 20, 2019
Telephone
+00-852-30756684
2019 6th International Conference on Mechanical Properties of Materials (ICMPM 2019)--Ei Compendex, Scopus
Welcome to ICMPM 2019
http://www.icmpm.org/
2019 6th International Conference on Mechanical Properties of Materials (ICMPM 2019) will be held in Paris, France during July 23-25, 2019.
Paper Publication
Option I. All accepted papers must be written in English and will be published in the conference proceedings, will be submitted for *Ei Compendex*, *Scopus* index.
Option II. International Journal of Materials, Mechanics and Manufacturing(ISSN: 1793-8198/DOI: 10.18178/IJMMM), Abstracting/Indexing: EI (INSPEC, IET), Chemical Abstracts Services (CAS), ProQuest, Crossref, Ulrich's Periodicals Directory, etc.
Submission Methods
1. Full Paper (Presentation and publication)
2. Abstract (Presentation only)
Please log in the Electronic Submission System(http://confsys.iconf.org/submission/icmpm2019)
or submit paper to: icmpm@outlook.com.
Conference Venue: Timhotel Paris Berthier
Address: 4 Boulevard Berthier, 17th arr., 75017 Paris, France
Lab visit could be arranged on July 25, 2019 in Paris, France, or one day tour could be arranged on July 25, 2019 in Paris, France.
Contact us
Conference Secretary: Mr. Jack Feng
E-mail: icmpm@outlook.com
Tel: +00-852-30756684
