Conference overview
★ICICM2024--Ei Compendex,Scopus--Wuhan, China★
★Full name: 2024 The 9th International Conference on Integrated Circuits and Microsystems
★Abbreviation: ICICM 2024
**Place: Wuhan, China
**Time: October 25-27, 2024
**Website: http://icicm.net/
★Co-Sponsored by:
==Southeast University, China
==University of Electronic Science and Technology of China, China
==Wuhan University of Technology, China
==Submission==
1. Full paper (publication and presentation)
2. Abstract (presentation only)
Electronic submission system: https://easychair.org/conferences/?conf=icicm2024
Email submission: icicm_conf@vip.163.com
More detail about submission, please visit at http://icicm.net/submission.html
=Publication=
The accepted and registered papers will be publication in Conference Proceedings, included in IEEE Xplore, which will be indexed by EI Compendex, Scopus, etc.
***ICICM2016-2023 has been successfully indexed by EI Compendex and Scopus already!
=Topics (include but not limit)=
► Devices and Circuits for Wirless System
► Application Specific Circuits and Systems for Communication
► Digital, Analog, Mixed Signal IC and SOC design technology
► Silicon integrated circuits and manufacturing
► Low-power, RF devices & circuits
► IC Computer-Aided –Design technology, DFM
► Silicon/germanium devices and device physics
► Interconnect, Low K, High K and other process technologies
► Unconventional and nano-electronics
► Organic semiconductor devices and technologies
► Compound semiconductor devices and circuits
► Displays, sensors and MEMS
► Semiconductor materials and material characterization
► Packaging and testing technology
► Solar cell & other devices for new energy sources
► Modeling and simulation
► Equipment technology
► Reliability
► Displays, sensors and MEMS
► Advance memories technology
For more topics, please visit at: http://icicm.net/call-for-papers.html
==Organizing Committee==
Advisory Chairs:
Junfa Mao, Shenzhen University, China;
Yue Hao, Xidian University, China.
Conference Chairs:
Zhigong Wang, Southeast University, China;
Ning Xu, Wuhan University of Technology, China.
Conference Co-Chairs:
Yu Wang,Tsinghua University,China;
Letian Huang, University of Electronic Science and Technology of China, China.
Program Chairs:
Jiliang Zhang, Hunan University, China;
Ying Wang, Institute of Computing Technology, Chinese Academy of Sciences, China;
Sheng Chang, Wuhan University, China;
Yingmei Chen, Southeast University, China;
Xiulong Wu, Anhui University, China;
Zhikuang Cai, Nanjing University of Posts and Telecommunications, China;
Zhuo Zou, Fudan University, China;
Jianguo Hu, Sun Yat-sen University , China;
Bei Yu,The Chinese University of Hong Kong, China.
Program Co-Chairs:
Junyong Deng, Xi'an University of Posts & Telecommunications, China;
Jun Xu, Nanjing University, China;
Zhixiong Di, Southwest Jiaotong University, China;
Guojie Luo, Peking University, China;
Xiaojun Zhai, University of Essex, UK;
Wei Xing, The University of Sheffield, UK.
Program Committee:
Shi Pu, Wuhan University of Technology , China;
Haizhi Song, University Of Electronic Science And Technology Of China, China;
Lu Zhu, Sun Yat-sen University, China;
Youming Zhang, Southeast University, China;
Jianshi Tang, Tsinghua University, China;
Weiguang Sheng, Shanghai Jiao Tong University, China;
Hao Gao, Austria & Eindhoven University of Technology, The Netherland;
Yun Fang, Silicon Austria Labs, Austria;
Jeff Kilby, Auckland University of Technology, New Zealand;
Zhijun Zhou, Southeast University, China;
Xingyuan Tong, Xi`an University Of Posts & Telecommunications, China;
Wei Hu, Northwestern Polytechnical University, China.
Local Chair:
Bowen Jia, Wuhan University of Technology , China.
Student Program Chairs:
Keping Wang, Tianjin University, China;
Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, China;
Fanyi Meng, Tianjin University, China.
Student Program Committee:
Li Du, Nanjing University, China;
Lei Wang, Nanjing University Of Posts And Telecommunications, China;
Xianbo Li, Sun Yat-sen University, China;
Tiehu Li, Chongqing University of Technology, China;
Moufu Kong, University of Electronic Science and Technology of China, China;
Jiaxin Liu, University of Electronic Science and Technology of China, China;
Maliang Liu, Xidian University, China.
More Organizing Committee list, please visit: https://icicm.net/committee.html
==History==
ICICM2016 | Chengdu on November 23-25, 2016
ICICM2017 | Nanjing on November 8-11, 2017
ICICM2018 | Shanghai on November 24-26, 2018
ICICM2019 | Beijing on October 25-27,2019
ICICM2020 | Nanjing on October 23-25, 2020
ICICM2021 | Nanjing on October 22-24, 2021
ICICM2022 | Xi'an on October 28-31, 2022
ICICM2023 | Nanjing on October 20-23, 2023
=CONTACT US=
Ms. Jenny Chow
Email: icicm_conf@vip.163.com
Web: http://icicm.net/
Tel: (86)134-0855-5552
★Full name: 2024 The 9th International Conference on Integrated Circuits and Microsystems
★Abbreviation: ICICM 2024
**Place: Wuhan, China
**Time: October 25-27, 2024
**Website: http://icicm.net/
★Co-Sponsored by:
==Southeast University, China
==University of Electronic Science and Technology of China, China
==Wuhan University of Technology, China
==Submission==
1. Full paper (publication and presentation)
2. Abstract (presentation only)
Electronic submission system: https://easychair.org/conferences/?conf=icicm2024
Email submission: icicm_conf@vip.163.com
More detail about submission, please visit at http://icicm.net/submission.html
=Publication=
The accepted and registered papers will be publication in Conference Proceedings, included in IEEE Xplore, which will be indexed by EI Compendex, Scopus, etc.
***ICICM2016-2023 has been successfully indexed by EI Compendex and Scopus already!
=Topics (include but not limit)=
► Devices and Circuits for Wirless System
► Application Specific Circuits and Systems for Communication
► Digital, Analog, Mixed Signal IC and SOC design technology
► Silicon integrated circuits and manufacturing
► Low-power, RF devices & circuits
► IC Computer-Aided –Design technology, DFM
► Silicon/germanium devices and device physics
► Interconnect, Low K, High K and other process technologies
► Unconventional and nano-electronics
► Organic semiconductor devices and technologies
► Compound semiconductor devices and circuits
► Displays, sensors and MEMS
► Semiconductor materials and material characterization
► Packaging and testing technology
► Solar cell & other devices for new energy sources
► Modeling and simulation
► Equipment technology
► Reliability
► Displays, sensors and MEMS
► Advance memories technology
For more topics, please visit at: http://icicm.net/call-for-papers.html
==Organizing Committee==
Advisory Chairs:
Junfa Mao, Shenzhen University, China;
Yue Hao, Xidian University, China.
Conference Chairs:
Zhigong Wang, Southeast University, China;
Ning Xu, Wuhan University of Technology, China.
Conference Co-Chairs:
Yu Wang,Tsinghua University,China;
Letian Huang, University of Electronic Science and Technology of China, China.
Program Chairs:
Jiliang Zhang, Hunan University, China;
Ying Wang, Institute of Computing Technology, Chinese Academy of Sciences, China;
Sheng Chang, Wuhan University, China;
Yingmei Chen, Southeast University, China;
Xiulong Wu, Anhui University, China;
Zhikuang Cai, Nanjing University of Posts and Telecommunications, China;
Zhuo Zou, Fudan University, China;
Jianguo Hu, Sun Yat-sen University , China;
Bei Yu,The Chinese University of Hong Kong, China.
Program Co-Chairs:
Junyong Deng, Xi'an University of Posts & Telecommunications, China;
Jun Xu, Nanjing University, China;
Zhixiong Di, Southwest Jiaotong University, China;
Guojie Luo, Peking University, China;
Xiaojun Zhai, University of Essex, UK;
Wei Xing, The University of Sheffield, UK.
Program Committee:
Shi Pu, Wuhan University of Technology , China;
Haizhi Song, University Of Electronic Science And Technology Of China, China;
Lu Zhu, Sun Yat-sen University, China;
Youming Zhang, Southeast University, China;
Jianshi Tang, Tsinghua University, China;
Weiguang Sheng, Shanghai Jiao Tong University, China;
Hao Gao, Austria & Eindhoven University of Technology, The Netherland;
Yun Fang, Silicon Austria Labs, Austria;
Jeff Kilby, Auckland University of Technology, New Zealand;
Zhijun Zhou, Southeast University, China;
Xingyuan Tong, Xi`an University Of Posts & Telecommunications, China;
Wei Hu, Northwestern Polytechnical University, China.
Local Chair:
Bowen Jia, Wuhan University of Technology , China.
Student Program Chairs:
Keping Wang, Tianjin University, China;
Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, China;
Fanyi Meng, Tianjin University, China.
Student Program Committee:
Li Du, Nanjing University, China;
Lei Wang, Nanjing University Of Posts And Telecommunications, China;
Xianbo Li, Sun Yat-sen University, China;
Tiehu Li, Chongqing University of Technology, China;
Moufu Kong, University of Electronic Science and Technology of China, China;
Jiaxin Liu, University of Electronic Science and Technology of China, China;
Maliang Liu, Xidian University, China.
More Organizing Committee list, please visit: https://icicm.net/committee.html
==History==
ICICM2016 | Chengdu on November 23-25, 2016
ICICM2017 | Nanjing on November 8-11, 2017
ICICM2018 | Shanghai on November 24-26, 2018
ICICM2019 | Beijing on October 25-27,2019
ICICM2020 | Nanjing on October 23-25, 2020
ICICM2021 | Nanjing on October 22-24, 2021
ICICM2022 | Xi'an on October 28-31, 2022
ICICM2023 | Nanjing on October 20-23, 2023
=CONTACT US=
Ms. Jenny Chow
Email: icicm_conf@vip.163.com
Web: http://icicm.net/
Tel: (86)134-0855-5552