Conference overview
【IEEE Official List Event--ICICM 2023】
★ICICM 2023--IEEE|Ei Compendex,Scopus--Nanjing, China★
★Full name: 2023 The 8th International Conference on Integrated Circuits and Microsystems
★Abbreviation: ICICM 2023
**Place: Nanjing, China
**Time: October 20-23, 2023
**Website: http://icicm.net/
★Co-Sponsored by:
==Southeast University, China
==University of Electronic Science and Technology of China, China
==Nanjing University of Posts and Telecommunications, China
==IEEE
==CAS
==Submission==
1. Full paper (publication and presentation)
2. Abstract (presentation only)
Electronic submission system: https://easychair.org/conferences/?conf=icicm2023
Email submission: icicm_conf@vip.163.com
More detail about submission, please visit at http://icicm.net/submission.html
=Publication=
The accepted and registered papers will be publication in IEEE Conference Proceedings, included in IEEE Xplore, which will be indexed by EI Compendex, Scopus, etc.
***ICICM 2016-2022 has been successfully indexed by EI Compendex and Scopus already!
***ICICM 2023 has been listed in IEEE Offcial Event List.
=Topics (include but not limit)=
► Thz and Microwave MicroSystem
► Devices and Circuits for Wirless System
► Application Specific Circuits and Systems for Communication
► Digital, Analog, Mixed Signal IC and SOC design technology
► Silicon integrated circuits and manufacturing
► Low-power, RF devices & circuits
► IC Computer-Aided –Design technology, DFM
► Silicon/germanium devices and device physics
► Interconnect, Low K, High K and other process technologies
► Unconventional and nano-electronics
► Organic semiconductor devices and technologies
► Compound semiconductor devices and circuits
► Displays, sensors and MEMS
► Semiconductor materials and material characterization
► Packaging and testing technology
► Solar cell & other devices for new energy sources
► Modeling and simulation
► Equipment technology
► Reliability
► Displays, sensors and MEMS
► Advance memories technology
For more topics, please visit at: http://icicm.net/call-for-papers.html
==Organizing Committee==
**Advisory Chair:
Pui-in Mak, University of Macau, Macau, China;
Ljiljana Trajkovic, Simon Fraser University, Canada.
**Conference Chairs:
Zhigong Wang, Southeast University, China;
Chen Liu, Nanjing University of Posts and Telecommunications, China;
Li Qiang, University of Electronic Science and Technology of China, China.
**Conference Co-Chairs:
Yufeng Guo, Nanjing University of Posts and Telecommunications, China;
Letian Huang, University of Electronic Science and Technology of China, China.
**Program Chairs:
Zhikuang Cai, Nanjing University of Posts and Telecommunications, China;
Junyong Deng, Xi'an University of Posts & Telecommunications.
**Program Co-Chairs:
Zhixiong Di, Southwest Jiaotong University, China;
Delong Shang, Insitute of Microelectronics of the Chinese Academy of Sciences, China;
Abdel-Hamid Ali Soliman, Staffordshire University, UK;
Alex Yakovlev, Newcastle University, UK.
**Program Committee:
Lu Zhu, Sun Yat-sen University, China;
Youming Zhang, Southeast University, China;
Weiguang Sheng, Shanghai Jiao Tong University, China;
Haizhi Song, University of Electronic Science and Technology of China,China;
Hao Gao, Austria & Eindhoven University of Technology, The Netherland;
Yun Fang, Silicon Austria Labs, Austria;
Jeff Kilby, Auckland University of Technology, New Zealand.
**Student Program Chairs:
Shiheng Yang, University of Electronic Science and Technology of China, China;
Chao Fan, Xi'an Jiaotong University, China.
**Special Session Chairs:
Chen Yang, Xi'an Jiaotong University, China;
Jianshi Tang, Tsinghua University, China;
Yuan Du, Nanjing University, China.
**Academic Committee Chairs:
Jin He, Peking University, China;
Fanyi Meng, Tianjin University, China.
**Academic Committee:
Kailin Ren, Shanghai University, China;
Yuanyuan Shi, University of Science and Technology of China, China;
Minghui Li, University of Glasgow, UK;
Wang Nan, Dalian University of Technology, China;
Wu Gao, Northwestern Polytechnical University, China.
**Publicity Chairs:
Huizhen Qian, University of Electronic Science and Technology of China, China;
Qiang Wu, Southwest Jiaotong University, China;
Jia Wang, Northwestern Polytechnical University, China;
Dengquan Li, Xidian University, China;
Pakornkiat Sawetmethikul, Rajamangala University of Technology Thanyaburi, Thailand;
Wei Ren, Xi’an University of Posts and Telecommunications, China.
==History==
ICICM2016 | Chengdu on November 23-25, 2016
ICICM2017 | Nanjing on November 8-11, 2017
ICICM2018 | Shanghai on November 24-26, 2018
ICICM2019 | Beijing on October 25-27,2019
ICICM2020 | Nanjing on October 23-25, 2020
ICICM2021 | Nanjing on October 22-24, 2021
ICICM2022 | Xi'an on October 28-31, 2022
=CONTACT US=
Ms. Jenny Chow
Email: icicm_conf@vip.163.com
Web: http://icicm.net/
Tel: (86)136-2777-7774
★ICICM 2023--IEEE|Ei Compendex,Scopus--Nanjing, China★
★Full name: 2023 The 8th International Conference on Integrated Circuits and Microsystems
★Abbreviation: ICICM 2023
**Place: Nanjing, China
**Time: October 20-23, 2023
**Website: http://icicm.net/
★Co-Sponsored by:
==Southeast University, China
==University of Electronic Science and Technology of China, China
==Nanjing University of Posts and Telecommunications, China
==IEEE
==CAS
==Submission==
1. Full paper (publication and presentation)
2. Abstract (presentation only)
Electronic submission system: https://easychair.org/conferences/?conf=icicm2023
Email submission: icicm_conf@vip.163.com
More detail about submission, please visit at http://icicm.net/submission.html
=Publication=
The accepted and registered papers will be publication in IEEE Conference Proceedings, included in IEEE Xplore, which will be indexed by EI Compendex, Scopus, etc.
***ICICM 2016-2022 has been successfully indexed by EI Compendex and Scopus already!
***ICICM 2023 has been listed in IEEE Offcial Event List.
=Topics (include but not limit)=
► Thz and Microwave MicroSystem
► Devices and Circuits for Wirless System
► Application Specific Circuits and Systems for Communication
► Digital, Analog, Mixed Signal IC and SOC design technology
► Silicon integrated circuits and manufacturing
► Low-power, RF devices & circuits
► IC Computer-Aided –Design technology, DFM
► Silicon/germanium devices and device physics
► Interconnect, Low K, High K and other process technologies
► Unconventional and nano-electronics
► Organic semiconductor devices and technologies
► Compound semiconductor devices and circuits
► Displays, sensors and MEMS
► Semiconductor materials and material characterization
► Packaging and testing technology
► Solar cell & other devices for new energy sources
► Modeling and simulation
► Equipment technology
► Reliability
► Displays, sensors and MEMS
► Advance memories technology
For more topics, please visit at: http://icicm.net/call-for-papers.html
==Organizing Committee==
**Advisory Chair:
Pui-in Mak, University of Macau, Macau, China;
Ljiljana Trajkovic, Simon Fraser University, Canada.
**Conference Chairs:
Zhigong Wang, Southeast University, China;
Chen Liu, Nanjing University of Posts and Telecommunications, China;
Li Qiang, University of Electronic Science and Technology of China, China.
**Conference Co-Chairs:
Yufeng Guo, Nanjing University of Posts and Telecommunications, China;
Letian Huang, University of Electronic Science and Technology of China, China.
**Program Chairs:
Zhikuang Cai, Nanjing University of Posts and Telecommunications, China;
Junyong Deng, Xi'an University of Posts & Telecommunications.
**Program Co-Chairs:
Zhixiong Di, Southwest Jiaotong University, China;
Delong Shang, Insitute of Microelectronics of the Chinese Academy of Sciences, China;
Abdel-Hamid Ali Soliman, Staffordshire University, UK;
Alex Yakovlev, Newcastle University, UK.
**Program Committee:
Lu Zhu, Sun Yat-sen University, China;
Youming Zhang, Southeast University, China;
Weiguang Sheng, Shanghai Jiao Tong University, China;
Haizhi Song, University of Electronic Science and Technology of China,China;
Hao Gao, Austria & Eindhoven University of Technology, The Netherland;
Yun Fang, Silicon Austria Labs, Austria;
Jeff Kilby, Auckland University of Technology, New Zealand.
**Student Program Chairs:
Shiheng Yang, University of Electronic Science and Technology of China, China;
Chao Fan, Xi'an Jiaotong University, China.
**Special Session Chairs:
Chen Yang, Xi'an Jiaotong University, China;
Jianshi Tang, Tsinghua University, China;
Yuan Du, Nanjing University, China.
**Academic Committee Chairs:
Jin He, Peking University, China;
Fanyi Meng, Tianjin University, China.
**Academic Committee:
Kailin Ren, Shanghai University, China;
Yuanyuan Shi, University of Science and Technology of China, China;
Minghui Li, University of Glasgow, UK;
Wang Nan, Dalian University of Technology, China;
Wu Gao, Northwestern Polytechnical University, China.
**Publicity Chairs:
Huizhen Qian, University of Electronic Science and Technology of China, China;
Qiang Wu, Southwest Jiaotong University, China;
Jia Wang, Northwestern Polytechnical University, China;
Dengquan Li, Xidian University, China;
Pakornkiat Sawetmethikul, Rajamangala University of Technology Thanyaburi, Thailand;
Wei Ren, Xi’an University of Posts and Telecommunications, China.
==History==
ICICM2016 | Chengdu on November 23-25, 2016
ICICM2017 | Nanjing on November 8-11, 2017
ICICM2018 | Shanghai on November 24-26, 2018
ICICM2019 | Beijing on October 25-27,2019
ICICM2020 | Nanjing on October 23-25, 2020
ICICM2021 | Nanjing on October 22-24, 2021
ICICM2022 | Xi'an on October 28-31, 2022
=CONTACT US=
Ms. Jenny Chow
Email: icicm_conf@vip.163.com
Web: http://icicm.net/
Tel: (86)136-2777-7774