(EPTC 2025) 2025 IEEE 27th Electronics Packaging Technology Conference
Electronics and Electrical EngineeringEngineering
Conference Date
Dec 02-Dec 05, 2025
Place
Singapore, Singapore
Submission Deadline
Oct 15, 2024
E-mail
secretariat@eptc-ieee.net
The IEEE Electronics Packaging Technology Conference (EPTC) is an annual international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region.
EPTC ORGANIZING COMMITTEE
Prof. Eric PHUA
Nanofilm Technologies Intl Ltd
General Chair
Dr. King Jien CHUI
Samsung
Past General Chair
Prof. Andrew TAY
National University of Singapore
External Relations
Dr. Chandra Rao BHESETTI
Institute of Microelectronics
Technical Co-Chair
Prof. Yeow Kheng LIM
National University of Singapore
Technical Chair
Dr. Chin Hock TOH
Technical Professional
Program Chair
Prof. Sunmi SHIN
National University of Singapore
PDC Chair
Mr. Vempati Srinivasa RAO
Institute of Microelectronics
Finance Chair
Dr. Yong Bo YANG
AMD Singapore
Facility Chair
Mr. Ranjan RAJOO
GlobalFoundries
Industry Relations Chair
Dr. Xueren ZHANG
AMD Singapore
Facility Co-Chair
Dr. Gong Yue TANG
Institute of Microelectronics
Publicity Chair
Prof. Alfred YEO
STATS ChipPAC, Singapore
Sponsorship Chair
Dr. Donny Lai
Nanyang Technological University
Sponsorship Co-Chair
Dr. Vivek CHIDAMBARAM
Intel Technology
Exhibition Chair
Mr. B. Senthil Kumar
Heraeus, Singapore
Exhibition Co-Chair
Dr. Prayudi Lianto
Applied Materials
IT Chair
Ms. Li Ying
Nanyang Technological University
IT Co-Chair