(EPTC 2025) 2025 IEEE 27th Electronics Packaging Technology Conference

Electronics and Electrical EngineeringEngineering

Conference Date

Dec 02-Dec 05, 2025

Place

Singapore, Singapore

Submission Deadline

Oct 15, 2024

E-mail

secretariat@eptc-ieee.net

Telephone

Description

The IEEE Electronics Packaging Technology Conference (EPTC) is an annual international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region.

EPTC ORGANIZING COMMITTEE

Prof. Eric PHUA
Nanofilm Technologies Intl Ltd
General Chair

Dr. King Jien CHUI
Samsung
Past General Chair

Prof. Andrew TAY
National University of Singapore
External Relations

Dr. Chandra Rao BHESETTI
Institute of Microelectronics
Technical Co-Chair

Prof. Yeow Kheng LIM
National University of Singapore
Technical Chair

Dr. Chin Hock TOH
Technical Professional
Program Chair

Prof. Sunmi SHIN
National University of Singapore
PDC Chair

Mr. Vempati Srinivasa RAO
Institute of Microelectronics
Finance Chair

Dr. Yong Bo YANG
AMD Singapore
Facility Chair

Mr. Ranjan RAJOO
GlobalFoundries
Industry Relations Chair

Dr. Xueren ZHANG
AMD Singapore
Facility Co-Chair

Dr. Gong Yue TANG
Institute of Microelectronics
Publicity Chair

Prof. Alfred YEO
STATS ChipPAC, Singapore
Sponsorship Chair

Dr. Donny Lai
Nanyang Technological University
Sponsorship Co-Chair

Dr. Vivek CHIDAMBARAM
Intel Technology
Exhibition Chair

Mr. B. Senthil Kumar
Heraeus, Singapore
Exhibition Co-Chair

Dr. Prayudi Lianto
Applied Materials
IT Chair

Ms. Li Ying
Nanyang Technological University
IT Co-Chair