Electronics and Electrical EngineeringEngineering

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society.

Call for papers:
Novel interconnect designs and technologies (including optical and wireless)
Unconventional interconnect technologies: transparent, wearable, bendable, environmentally-friendly, made in MEMS- and nano-technology
High-frequency interconnects and packages for RF, microwave, mmWave applications; antennas-in-package
High-speed channels, backplanes, SerDes, memory and DDR interfaces
Signal and power integrity
Jitter and noise
Interconnect and transceiver co-design, equalization
Low-power interconnects and transceivers
2.5D/3D integration: interconnection and packaging aspects
Advanced packaging
Design and co-design of interconnects and packages
Quantum systems: interconnection and packaging aspects
Measurement techniques, challenges
Manufacturing, testing, reliability, repairability
Modeling, simulation, computer-aided design (including macro-modeling, model order reduction, optimization, uncertainty, yield)
Electromagnetic modeling and simulation
Machine learning and AI-based approaches
Thermal, mechanical, multiphysics modeling

The conference will be held at the Sonesta San Jose - Milpitas, 777 Bellew Drive, Milpitas, CA 95035, USA

Questions regarding administration of the meeting may be directed to:
Conference General Co-Chair:
Wendem Beyene, Meta Platforms, wendem@gmail.com
Xu Chen, University of Illinois, Urbana-Champaign, xuchen1@illinois.edu
or
Attn: EPEPS Administration
epeps-admin@emlab.illinois.edu
Email: epeps-admin@emlab.illinois.edu