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The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS.

The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.

Technical Committee:
Wilfrid Aklamavo, SERMA MICROELECTRONICS, France
Mariya Aleksandrova, Technical University of Sofia, Bulgaria
Apostol Apostolov, Bulgarian Academy of Sciences, Bulgaria
Rolf Aschenbrenner, Fraunhofer IZM, Germany
Laurent Barreau, ST Microelectronics, France
Sidahmed Beddar, VALEO, France
Anandaroop Bhattacharya, IIT Kharagpur, India
Olivier Billaud, VALEO LIGHT, France
Cyril Buttay, CNRS / Laboratoire Ampere, France
Luigi Calligarich, Electron Mec srl, Italy
Emilian Ceuca, University of Alba Iulia, Romania
Norocel Codreanu, POLITEHNICA Bucharest, Romania
Romain Coffy, STMicroelectronics, France
Suzanne Costello, Forensic Eyes, United Kingdom
Pascal Couderc, France
Walter de Munnik, JCET, The Netherlands
Jean-luc Diot, ASSEMBLINNOV, France
Franck Dosseul, MODULEUS, France
Bradford J. Factor, ASE, France
Christopher Gourlay, Imperial College London, United Kingdom
Gabor Harsanyi, Budapest University of Technology and Economics, Hungary
Sheikh Hassan, University of Greenwich, United Kingdom
Daniel Hubert, VALEO, France
Gabriel Kopp, VALEO, France
Ricky S W Lee, HKUST, Hong Kong
Tekfouy Lim, Fraunhofer IZM, Germany
Voya Markovich, United States
Laurent Mendizabal, CEA – LETI, France
Jens Müller, TU Ilmenau, Germany
Hiroshi Nishikawa, Osaka University, Japan
Ali Roshanghias, Silicon Austria Labs GmbH, Austria
Mark Shaw, STMicroelectronics, Italy
Jean-Charles Souriau, CEA-Leti, France
Stoyan Stoyanov, University of Greenwich, United Kingdom
Martino Taddei, GESTLABS S.r.l, Italy
Alexandre Val, VALEO, France
Valérie Volant, STM, France
Nadia Wazad, AIRBUS DEFENCE AND SPACE, France
Chunyan Yin, Southeast University, China
Sung-Uk Zhang, Dong-Eui University, South Korea
Christophe Zinck, ASE Group, France
Zdravko Zojceski, VALEO, France

Conference topics:
1.Advanced Packaging and System-Integration
System in Package:
New SiP developments, SiP testing; Modules in a package, double sided modules, antenna in package; Chip embedding technologies.

IC Packaging:
Single- and multi-chip packaging, heterogeneous integration, chiplets, WLP, 2.5D/3D-IC, interposers, high-frequency, and high-power packaging, quilt packaging, logic and memory chip integration.

Interconnection Technologies:
Disruptive interconnections, bumping technologies, TSVs and vias; Optical connections, RDLs, 3D printable interconnects.

Optoelectronics:
Assembly and packaging technologies for optical and photonics applications; Co-packaged optics, hybrid and heterogeneous photonics integration; Microscopy, imaging, displays; Equipment and tools.

2.Specialised Topics
Power Electronics:
Advances in wide-bandgap semiconductor materials and technologies; Si, GaN, SiC packaging, Ag and Cu sintering, SiC wafer sawing, interconnection technologies, test and reliability.

Medical Electronics:
Bio-medical applications, medical devices; Biosensors and bioelectronics; Complying with material and test regulations, and market requirements; Medical imaging.

Green Electronics and Sustainability:
Green and sustainable manufacturing; Renewable energy, solar energy, and photovoltaics technologies; Energy storage, battery technologies; Packaging for improved efficiency of photovoltaic modules; Materials recovery and recycling, Product Carbon Footprint; Sustainability and environment.

3.Materials and Processes
Materials:
Solder alloys, materials for harsh environments, solder alternatives, conductive/ nonconductive adhesives, encapsulants, smart materials, TIM, high temperature materials.

Substrate Technologies:
Advanced substrate design and technologies, flexible/ stretchable electronics, organic, inorganic, laminates, printed, microfluidics.

Assembly & Manufacturing:
Process development, clean room technologies, process and yield enhancements, micromachining, equipment development.

Emerging Technologies:
Nanotechnology, sensing technologies, MEMS and NEMS, packaging for extreme harsh environments.

Smart manufacturing:
AI-enabled technologies, Additive Manufacturing, assembly factory automation.