2023 3rd IEEE International Conference on Software Engineering and Artificial Intelligence (SEAI 2023)

softwareartificial intelligence

Conference Date

Jun 16-18, 2023

Place

Xiamen, China

Submission Deadline

Jan 25, 2023

E-mail

seai_conf@163.com

Telephone

13096333337

Description

Abbreviation: SEAI 2023
Full Name: 2023 3rd IEEE International Conference on Software Engineering and Artificial Intelligence (SEAI 2023)
Xiamen, China
June 16-18, 2023
http://www.seai.org/

Publication:
All registered and presented papers will be published in Conference Proceedings, which will be submitted to Ei Compendex and Scopus.

Call for Paper:
Artificial Intelligence & Applications
AI Algorithms
Knowledge-based Systems
CAD Design & Testing
Software Engineering Techniques and Production Perspectives
Requirements Engineering
Software Analysis, Design and Modeling
Software Maintenance and Evolution
Multimedia and Hypermedia Software Engineering
Software Engineering Methodologies
Agent-based Software Engineering
Software & System Quality of Service
Soft Computing
Software and System Testing Methods
Software & System Security
Software and System Security and Privacy
Mobile APP Security and Privacy
Encryption Methods and Tools
Security Service Systems
More topics via: http://www.seai.org/topic.html

Venue: Pan Pacific Xiamen
Address: 19 Hubin Bei Road, Xiamen, Fujian, China 361012

Submission Methods:
Full Paper (publication and oral presentation)
Abstract (oral presentation only)
Electronic Submission System (.pdf)
http://confsys.iconf.org/submission/seai2023
or submit it via email: seai_conf@163.com.

Contact Us:
Ms. Ching Cao
E-mail: seai_conf@163.com