2022 IEEE the 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (IEEE MAPE 2022)

Communication EngineeringComputer Science and Technologies

Conference Date

Aug 26-29, 2022


Chengdu, China

Submission Deadline

Jun 25, 2022






△Full name: 2022 IEEE the 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (IEEE MAPE 2022)--EI Compendex, Scopus
△Abbreviation: IEEE MAPE
△Date:August 26 to 29, 2022
△Venue:Chengdu, China

Welcome to attend 2022 IEEE the 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (IEEE MAPE), which will be held in Chengdu, China from August 26 to 29, 2022.
IEEE MAPE 2022 is sponsored by IEEE, Beijing Jiaotong University and University of Electronic Science and Technology of China, and is technically supported by the IEEE Antennas and Propagation Society.
MAPE was initiated to celebrate of the 20th anniversary of the foundation of IEEE Beijing Section in 2005, after several years, it becomes the flagship wireless event of the IEEE Beijing Section geared toward wireless communication industry professionals interested in the latest research and design.

Submitted papers will be peer reviewed and accepted papers after proper registration will be included in the conference proceedings to be published with conference proceedings,
which will be submitted and reviewed by IEEE Xplore, EI Compendex and Scopus, etc.

Conference Committee:
International Advisory Committee:
Cynthia Furse, IEEE Fellow, University of Utah, USA;
David Davidson, IEEE Fellow, Curtin University, Australia;
Hisamatsu Nakano, IEEE Life Fellow, Hosei University, Japan;
Koichi Ito, IEEE Life Fellow, IEICE Fellow, Chiba University, Japan;
Kwai Man Luk, IEEE Fellow, City University of Hong Kong, China;
Yahia Antar, IEEE Fellow, Royal Military College, Canada;
Banmali Rawat, University of Nevada, USA;
Hiroshi Iwai, National Yang Ming Chiao Tung University, Taiwan, China;
Petrie Meyer, Stellenbosch University, South Africa;
Roberto Graglia, Politecnico di Torino, Italy;
Weng Cho Chew, University of Illinois, USA.

Conferenc Co-chairs:
W. Ross Stone, Chair of IEEE Publication Committee, Honorary Life Member of IEEE
Yinghong Wen, Dean, Zhantianyou College, Beijing Jiaotong University, China
Shiwen Yang, IEEE Fellow, University of Electronic Science and Technology of China, China

Technical Program Co-chairs:
Makoto Ando, IEEE Fellow, Tokyo Institute of Technology, Japan
Giuseppe Pelosi, University of Florence, Italy
Yikai Chen, University of Electronic Science and Technology of China, China
Wei Jiang, Beijing Jiaotong University, China

Regional Chair of Germany:
Werner Wiesbeck, Karlsruhe Institut of Technology, Germany

Regional Chair of Canada:
Lot Shafai, University of Manitoba, Canada

Regional Chair of Spain:
Eva Rajo-Iglesia, University Carlos III of Madrid, Spain

Regional Chair of Singapore:
Zhongxiang Shen, Nanyang Technological University, Singapore

Regional Chair of Harbin:
Yingsong Li, Harbin Engineering University, China

Organizing Committee Chair:
Mengqi Zhou, IEEE China Council, China

Technical Program Committee Members:
Guo Xie, Xi'an University of Technology, China;
Jinbao Zhang, Beijing Jiaotong University, China;
Jiang Liu, Beijing Jiaotong University, China;
Jinjun Feng, Beijing Vacuum Electronics Research Institute, China;
Meng Li, Hefei University of Technology, China;
Mitsuo Taguchi, Nagasaki University, Japan;
Wenhua Yu, Computer and Communication Unlimited, USA;
Yanzhao Xie, Xi'an Jiaotong University, China.

Call for papers:
The topics of the symposium will cover all of the interesting theory and techniques of microwaves, antennas, propagation, and EMC necessary for wireless communications.
The topics included but not limited to below:

1. Systems and Services
* Mobile satellite communication
* Wireless Sensors and Ad Hoc Networks
* MIMO Technologies
* UWB and Impulse Radio
* 6G Mobile Wireless Systems
* Space-Time Channel Characterization and Modeling

2. Microwave Electronics
* Passive and Active Circuits
* Power Amplifiers, Linearization, and Active Components
* MMICs and Microwave Circuits
* Microwave and Millimetre-Wave ICs
* Millimetre-Wave and Sub-Millmetre-Wave Components,
Circuits and Systems
* Waveguide Structures

3. Antennas
* Microstrip and Printed Antennas
* Active and Integrated Antennas
* Array Antennas, Phased Arrays, and Feeding Circuits
* Mobile and Base Station Antennas
* Adaptive and Smart Antennas
* Ultra-Wideband, Broadband, and Multi-band Antennas
* Reconfigurable Antennas and Arrays
* Millimeter Wave and Sub-Millimeter Wave Antennas
* MEMS/Nanotechnology for antennas

4. Propagation
* Mobile and Indoor Propagation
* Millimeter- and Optical-Wave Propagation
* Earth-Space and Terrestrial Propagation
* Ionospheric Propagation
* Propagation and channel characterization
* Diversity Techniques and Fading Countermeasures
* Signal Separation and Interference Rejection
* Random Media and Rough Surfaces

5. Electromagnetics
* Electromagnetic Theory
* Metamaterials
* Complex Media and Artificial Media
* Computational Electromagnetics
* High-Frequency Techniques
* Time-Domain Techniques

6. EMC Technologies
* EMC Sources: Electromagnetic Environment, Lightning, Intentional EMI & EMP, High Power Electromagnetics, ESD, UWB
* EMC of Components & Integrated Circuits, PCB, Electronic Packaging & Integration
* EMC in Power Systems, Power Quality
* System Level EMC
* EMC in Power Electronics
* EMC in Smart Grids
* EMC in Internet of Things
* EMC in Communications: Wired & Wireless Communications, 6G, UWB, Power Line Communications
* EMC Standards, Management & Regulations
* EMC in Aerospace

Paper Submission:
Submission by MAPE 2022 EasyChair Account:

Conferenec Secretary: Frannie Lee
Contact Email: contact@ieee-mape.org
Tel: +86-13540032551